flip-chip

This packed conference brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly.  IMAPS Symposium offers a robust technical program with 5 concurrent tracks and 100+ speakers and posters covering SiP Design / Manufacturing Optimization; Wafer Level / Panel Level (Advanced RDL); High Performance, High Reliability; Advanced Packages (Flip Chip, 2.5D,… 56th International Microelectronics Assembly and Packaging Society (IMAPS)