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56th International Microelectronics Assembly and Packaging Society (IMAPS)
October 2 @ 8:00 am - October 5 @ 5:00 pm PDT
This packed conference brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly. IMAPS Symposium offers a robust technical program with 5 concurrent tracks and 100+ speakers and posters covering SiP Design / Manufacturing Optimization; Wafer Level / Panel Level (Advanced RDL); High Performance, High Reliability; Advanced Packages (Flip Chip, 2.5D, 3D, Optical); and Advanced Process & Materials.
Professional Development Courses are supplemental two-hour classroom-style tutorials with a narrow educational focus taught by the best in the industry. The topics offered at IMAPS 2023 are designed to help attendees broaden their scope of knowledge.
The 2023 PDC courses are offered on Monday, October 2, prior to IMAPS 2023. Attendees must register for each course as an add-on to their overall symposium registration – additional fee for each PDC selected. Attendees may select up to one course in each time slot. Make sure to review your preferred course’s time slot before registration.