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  • ChipEx 2022

    Expo Tel Aviv Tel Aviv, Israel

    ChipEx2022 The main event of the Israeli semiconductor industry, will be held on May 10, 2022 at the Expo Tel Aviv Conference Center. The event is expected to attract thousands of industry professionals including engineers, development managers, project managers, professional experts, procurement managers and more. ChipEx2022 will include lectures by the best experts from around the world who will deal… ChipEx 2022

  • The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

    As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges. Join us on Wednesday, November 16 at 9:00 a.m. PST for an informative webinar on The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions… The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

  • TSMC 2023 North America OIP Ecosystem Forum

    Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United States

    Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22 Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile… TSMC 2023 North America OIP Ecosystem Forum

  • Chiplet Summit

    Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United States

    The Second Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible. This unique event gives attendees a place to network with peers, ask questions of the experts,… Chiplet Summit

  • SNUG Silicon Valley 2024

    Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United States

    Connecting the Synopsys User Community SNUG conferences have connected Synopsys global users for more than three decades. SNUG 2024 will once again provide a place where users and technical experts can meet, network, and share ideas about chip and system design. Technical Committee SNUG thanks the members of the Technical Committee who volunteer their time… SNUG Silicon Valley 2024

  • ChipEx 2024

    Tel Aviv Convention Center Rokach Boulevard 101, Tel Aviv, Israel

    ChipEx2024, the largest annual event of the Israeli semiconductor industry, will be held on May 7-8, 2024 in Tel Aviv, Israel. ChipEx2024 showcases companies including manufacturers, developers and suppliers of advanced hardware technologies & services. It also includes a technical seminar where the world's leading experts address the industry's most relevant issues. The event is… ChipEx 2024

  • TSMC North America OIP Ecosystem Forum 2024

    Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United States

    Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design… TSMC North America OIP Ecosystem Forum 2024

  • 2024 TSMC Europe OIP Ecosystem Forum

    Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701 Amsterdam, Amsterdam, Netherlands

    Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design… 2024 TSMC Europe OIP Ecosystem Forum

  • ICCAD-Expo 2024

    Shanghai International Convention Center No. 2727, Riverside Avenue, Shanghai, China

    The China Integrated Circuit Design Industry Exhibition (ICCAD-Expo) has always played an important role in promoting industrial agglomeration, connecting industrial resources, and mastering industry trends.

  • SNUG Silicon Valley 2025

    Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United States

    Connecting the Synopsys User Community SNUG conferences have connected Synopsys global users for more than three decades. SNUG 2025 will once again provide a place where users and technical experts can meet, network, and share ideas about chip and system design. We are thrilled to announce that SNUG Silicon Valley is celebrating its 35th year… SNUG Silicon Valley 2025