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The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
November 16 @ 9:00 am - 10:00 am PST
As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges.
Join us on Wednesday, November 16 at 9:00 a.m. PST for an informative webinar on The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
Hear 3 unique perspectives on this growing market:
- Stefan Chitoraga, Technology and Market Analyst at Yole Développement will present the latest market insights on the adoption of chiplets and heterogeneous integration and will address what is driving advanced packaging toward 2.5D and 3D solutions.
- Igor Elkanovich, CTO at Global Unichip Corp. (GUC) will discuss the GUC GLink™ chiplet interconnect, including its architecture and roadmap; HBM3 memory interfaces; and will also highlight some of the 2.5D and 3D packaging challenges.
- Nir Sever, Senior Director of Business Development at proteanTecs will reveal silicon results from a GUC GLink chip, which used D2D interconnect monitoring for comprehensive visibility and parametric lane grading.