iMAPS
Events
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19th International Conference & Exhibition on Device Packaging
We-Ko-Pa Resort & Conference Center 10438 Wekopa Way, Fort McDowell, AZ, United StatesThe most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers and top experts participating in a multi-faceted technical program and unique networking events. Full… 19th International Conference & Exhibition on Device Packaging
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56th International Microelectronics Assembly and Packaging Society (IMAPS)
This packed conference brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly. IMAPS Symposium offers a robust technical program with 5 concurrent tracks and 100+ speakers and posters covering SiP Design / Manufacturing Optimization; Wafer Level / Panel Level (Advanced RDL); High Performance, High Reliability; Advanced Packages (Flip Chip, 2.5D,… 56th International Microelectronics Assembly and Packaging Society (IMAPS)