Microsoft
How to Sign Off a 10 Billion+ Transistor Design in the Cloud
Advanced semiconductor applications such as artificial intelligence / machine learning (AI/ML) and graphic processing units (GPUs) fully leverage dense, advanced-node technology to push the extreme limits of design size. To signoff such large designs, engineers are increasingly relying on distributed compute methods to accelerate the signoff analysis. Furthermore, given lack of scalability of on-premises compute… How to Sign Off a 10 Billion+ Transistor Design in the Cloud
FPGA 22
The ACM/SIGDA International Symposium on Field-Programmable Gate Arrays is a premier conference for presentation of advances in FPGA technology. Accepted papers will be published in the conference proceedings and available in the ACM Digital Library. Virtual Conference February 27 – March 1, 2022 Registration now open at: www.isfpga.org/registration Statement from the General Chair: We have made… FPGA 22
Rapidly Scale and Reduce Time-to-Market for Your Designs with Synopsys Cloud
Presented by Sridhar Panchapakesan, Director, Program Management, Synopsys; Giancarlo DiPasquale, Sr Technical Specialist, Microsoft Talk Cloud has democratized access to increasing compute power by lowering barriers to entry, creating the flexibility to scale elastically, and enabling distributed workloads. But there is more to moving EDA to the cloud than simply swapping on-prem hardware for cloud;… Rapidly Scale and Reduce Time-to-Market for Your Designs with Synopsys Cloud
Rapidly Scale and Reduce Time-to-Market for Your Designs with Synopsys Cloud
Cloud has democratized access to increasing compute power by lowering barriers to entry, creating the flexibility to scale elastically, and enabling distributed workloads. But there is more to moving EDA to the cloud than simply swapping on-prem hardware for cloud; software needs the same license flexibility and elasticity to match. Learn how Synopsys Cloud’s disruptive… Rapidly Scale and Reduce Time-to-Market for Your Designs with Synopsys Cloud
PSI-K Conference
SwissTech Convention Center Lausanne, SwitzerlandThe conference will be the 6th general conference for the worldwide Psi-k community, following very successful events held in San Sebastian (2015), Berlin (2010), and Schwäbisch Gmünd (2005, 2000, 1996). This major conference – the largest worldwide in electronic-structure – brings together the community that is active in the field, as described by the Psi-k… PSI-K Conference
AI Hardware Summit
Santa Clara Marriott 2700 Mission College Blvd, Santa Clara, CA, United StatesThe AI Hardware Summit is the premier commercial event focused on systems-first machine learning. Our community’s goal is to reduce time-to-value in the ML lifecycle, and to unlock new possibilities for AI development. This involves a full-stack effort of efficient operationalization of AI in organizations, productionization of models, tight hw/sw co-design and best-in-class microarchitectures.… AI Hardware Summit
CHIPS Alliance, Fall Technology Update
Join us in-person for our second biannual technology update featuring informative, technical talks on open source hardware collaborative development, hosted by Google and including speakers from Microsoft, Google, Intel, Antmicro, Efabless and others. CHIPS’ Thursday event follows the main RISC-V Summit days (Tuesday-Wednesday) to allow easy participation for open source hardware professionals traveling to the… CHIPS Alliance, Fall Technology Update
CES 2023
Las Vegas Covention and World Trade Center 3150 Paradise Rd, Las Vegas, NV, United StatesCES® is the most influential tech event in the world — the proving ground for breakthrough technologies and global innovators. This is where the world's biggest brands do business and meet new partners, and the sharpest innovators hit the stage. Owned and produced by the Consumer Technology Association (CTA)®, CES features every aspect of the… CES 2023
Hardware Security 2.0: What Are The New Frontiers?
The CAD for Trust and Assurance website is an academic dissemination effort by researchers in the field of hardware security. The goal is to assemble information on all CAD for trust/assurance activities in academia and industry in one place and share them with the broader community of researchers and practitioners in a timely manner, with… Hardware Security 2.0: What Are The New Frontiers?
THE DATA REVOLUTION OF SEMICONDUCTOR PRODUCTION
The demand for efficient and scalable chip production has never been greater. The need to scale at volume and adapt to shorter innovation cycles makes machine learning and advanced data analytics essential components of semiconductor production. Join us on Tuesday, March 7, 2023, for this 1-hour panel discussion with industry experts from Qualcomm, Microsoft Azure and Advantest as we discuss… THE DATA REVOLUTION OF SEMICONDUCTOR PRODUCTION
AI Hardware & Edge AI Summit
Santa Clara Marriott 2700 Mission College Blvd, Santa Clara, CA, United StatesThe combined AI Hardware & Edge AI Summit comprehensively covers the design and deployment of ML hardware and software infrastructure across the cloud-edge continuum. For Enterprise ML Experts: Attend a unique AI systems event that will give you both hardware and software tools and techniques for training, deploying, and serving machine learning – the program contains… AI Hardware & Edge AI Summit
TSMC 2023 North America OIP Ecosystem Forum
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22 Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile… TSMC 2023 North America OIP Ecosystem Forum