NGMM

Join industry experts from aerospace, government, and defense as they discuss the complexities of 3D Heterogeneous Integration (3DHI), highlighting some of the technological, manufacturing, and economic complexities as well as security, reliability, and safety challenges.  The panelists will also share their insights on chiplets and interface compatibility in addition to how DARPA’s NGMM (Next-Generation Microelectronics Manufacturing research… Tackling Challenges in 3D Heterogenous Integrated (3DHI) Microelectronics for Aerospace, Government, and Defense Systems