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Tackling Challenges in 3D Heterogenous Integrated (3DHI) Microelectronics for Aerospace, Government, and Defense Systems
November 9, 2023 @ 1:00 pm - 2:00 pm EST
Join industry experts from aerospace, government, and defense as they discuss the complexities of 3D Heterogeneous Integration (3DHI), highlighting some of the technological, manufacturing, and economic complexities as well as security, reliability, and safety challenges. The panelists will also share their insights on chiplets and interface compatibility in addition to how DARPA’s NGMM (Next-Generation Microelectronics Manufacturing research program plans to grow the 3DHI R&D ecosystem. Whether you are an engineer or a policymaker looking to deepen your 3DHI knowledge, this panel offers insightful discussions to help anticipate and address future microelectronics design challenges for aerospace, government, and defense systems.
Speakers
Ian Land
Synopsys
Senior Director, Security, Government and Aerospace Solutions
Moderator
Dr. Carl McCants
Special Assistant to the DARPA Director
Dr. Josh Fryman
Intel Corporation
Fellow
Rob Aitken
Synopsys
Distinguished Architect