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The 26262 Club – Technical Conference

Holiday Inn Munich - City Centre Hochstraße 3, Munich, Germany

MEET US AT THE 26262 CLUB TECHNICAL CONFERENCE THIS COMING DECEMBER 5, 2022 In this edition, the 26262 club continues the discussion on the anticipated third edition and the emerging role of ISO 26262 within the evolving standards ecosystem. We bring on stage key global players from WG8 alongside authors of the most prominent upcoming standards and share must-have insights from the global standardisation… The 26262 Club – Technical Conference

ISSCC 2023

Marriott Marquis 780 Mission Street, San Francisco, CA, United States

ISSCC 2023 is planned as a fully in-person event. On-demand access to ISSCC papers and educational material will be possible for people who cannot travel to San Francisco, but the conference will be optimized for an in-person experience. We keep monitoring the COVID-19 pandemic and we will promptly inform you should any change in our… ISSCC 2023

AI-Powered Prediction for Semiconductor Designs

Join our live Webinar on AI-Powered Prediction for Semiconductor Designs. Hear from experts at TOffeeAM, Machine Discovery, and Nvidia on the latest advancements in AI-powered thermal management, analog verification, and building the AI factory. A must-attend for professionals in the semiconductor, electronics, and AI industries. Register now! Speakers Marco Pietropaoli TOffeeAM Marco is the CEO… AI-Powered Prediction for Semiconductor Designs

IRPS 2023

Hyatt Regency Monterey 1 Old Golf Course Rd, Monterey, CA, United States

For 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world… IRPS 2023 will be presented as an in-person conference, with a virtual component available. The… IRPS 2023

Static Sign-Off Symposium 2023

DoubleTree Hotel 2050 Gateway Place, San Jose, CA, United States

Advanced Static Sign-Off Methodologies Leading SoC designers will share their advanced static sign-off methodologies and best practices to support first-silicon design goals, along with results achieved in accelerating early functional verification and sign-off of digital designs. Topics will include: AI/ML, targeted sign-off, incremental sign-off, multimode, hierarchical, dynamic CDC, and more. Advanced Static Sign-Off Methodology Presenters:… Static Sign-Off Symposium 2023

ITF World 2023

Flanders Meeting & Convention Center Antwerp Antwerp, Belgium

Imec’s flagship event on semiconductor advances & deep-tech solutions formerly known as Future Summits. Semiconductors have become increasingly instrumental – and often even dominant – for the future of industries and application domains worldwide. For many decades, imec has played a major role in the global semiconductor industry. Our expertise and partnerships now also progress… ITF World 2023

How AI and Semiconductors Will Drive Innovation and Productivity

Semiconductors are critical to the functioning of the modern world driving economic competitiveness, national security, and technologies ranging from modern defense capabilities to autonomous vehicles. Artificial Intelligence and the hardware used in this platform are impacting how the world will use information to increase productivity. The semiconductors used in these platforms are instrumental to its… How AI and Semiconductors Will Drive Innovation and Productivity

ERI 2.0 Summit

Hyatt Regency Seattle 805 Howell Street, Seattle, WA, United States

Watch as leaders from our government agencies, the Defense Industrial Base, and prestigious universities bring unique and indispensable perspectives on our domestic semiconductor industry, national and economic security, and future research directions. The Electronics Resurgence Initiative (ERI), DARPA’s response to national-level microelectronics concerns, is designed to ensure U.S. leadership in cross-functional, next-generation microelectronics research, development,… ERI 2.0 Summit

Hot Chips 2023

Stanford University 471 Lagunita Drive, Stanford, CA, United States

Hot Chips 2023 (advance program) will be held as a hybrid conference with in-person attendance at Stanford University from August 27 to 29, 2023. Conference Format Hot Chips 2023 will be a hybrid conference. You may register to attend virtual or in-person. The conference venue is the Dinkelspiel Auditorium on the Stanford University Conference. Sunday… Hot Chips 2023

TSMC 2023 North America OIP Ecosystem Forum

Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United States

Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22 Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile… TSMC 2023 North America OIP Ecosystem Forum

EDPS 2023

Synopsys Building 1 800 North Mary Avenue, Sunnyvale, CA, United States

EDPS 2023 is approaching fast! The program is firming up - please see the program page for a preliminary list of talks. REGISTRATION IS NOW OPEN. Everyone, including speakers, must register. 2023-ieee-edps.eventbrite.com Note that this year we'll be meeting on the Synopsys Campus. Synopsys Building 1 800 North Mary Avenue Sunnyvale, CA, 94085   Most of the talks… EDPS 2023

EPEPS 2023

Sonesta San Jose - Milpitas 777 Bellew Drive, Milpitas, CA, United States

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave… EPEPS 2023