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OpenFive
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IP-SOC China 22
The semiconductor world has to face a worldwide accelerated evolution, never seen before, both in terms of technology evolution (3D Packaging, advanced nodes) as well as new applications (IoT, Artificial… IP-SOC China 22
Embedded Vision Summit
Santa Clara Convention Center 5001 Great America Parkway, Santa ClaraThe premier event for practical, deployable computer vision and visual AI, for product creators who want to bring visual intelligence to products. The Summit attracts a global audience of technology… Embedded Vision Summit
Scalable HPC platform and memory expansion techniques using Die-to-Die and LPDDR subsystems
With advanced packaging and interface solutions, it is possible to connect multiple CPU clusters (near or far) and share external memory resources among them. We will review some of the… Scalable HPC platform and memory expansion techniques using Die-to-Die and LPDDR subsystems