Demand for next-generation wireless communication, aerospace, and transportation systems is driving the need for high-performance, cost-sensitive silicon RFICs and III-V compound semiconductor monolithic microwave integrated circuits (MMICs), often integrated into advanced system-in-package (SiP) modules. Join us as we demonstrate how the key new features of the Cadence® AWR Design Environment platform: Accelerates design entry and platform design sharing to… Read More »Cadence Further Streamlines MMIC, RFIC, and RF SiP Design Workflows