Cadence Further Streamlines MMIC, RFIC, and RF SiP Design Workflows
October 18 @ 9:00 am - 10:00 am PDT
Demand for next-generation wireless communication, aerospace, and transportation systems is driving the need for high-performance, cost-sensitive silicon RFICs and III-V compound semiconductor monolithic microwave integrated circuits (MMICs), often integrated into advanced system-in-package (SiP) modules.
Join us as we demonstrate how the key new features of the Cadence® AWR Design Environment platform:
- Accelerates design entry and platform design sharing to enhance engineering productivity
- Meets the challenging performance requirements of these wireless systems
- Provides less turnaround time through RF to mmWave design, EM analysis, & front-to-back workflows interoperability with the Cadence Virtuoso Design Platform