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Cadence Further Streamlines MMIC, RFIC, and RF SiP Design Workflows

October 18 @ 9:00 am - 10:00 am PDT

Cadence, October 18, 2022

Demand for next-generation wireless communication, aerospace, and transportation systems is driving the need for high-performance, cost-sensitive silicon RFICs and III-V compound semiconductor monolithic microwave integrated circuits (MMICs), often integrated into advanced system-in-package (SiP) modules.

Join us as we demonstrate how the key new features of the Cadence® AWR Design Environment platform:

  • Accelerates design entry and platform design sharing to enhance engineering productivity
  • Meets the challenging performance requirements of these wireless systems
  • Provides less turnaround time through RF to mmWave design, EM analysis, & front-to-back workflows interoperability with the Cadence Virtuoso Design Platform

Details

Date:
October 18
Time:
9:00 am - 10:00 am PDT
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Organizer

Cadence
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