Cadence Further Streamlines MMIC, RFIC, and RF SiP Design Workflows

Demand for next-generation wireless communication, aerospace, and transportation systems is driving the need for high-performance, cost-sensitive silicon RFICs and III-V compound semiconductor monolithic microwave integrated circuits (MMICs), often integrated into advanced system-in-package (SiP) modules.

Join us as we demonstrate how the key new features of the Cadence® AWR Design Environment platform:

• Accelerates design entry and platform design sharing to enhance engineering productivity
• Meets the challenging performance requirements of these wireless systems
• Provides less turnaround time through RF to mmWave design, EM analysis, & front-to-back workflows interoperability with the Cadence Virtuoso Design Platform