Latest Past Events

Cadence Further Streamlines MMIC, RFIC, and RF SiP Design Workflows

Demand for next-generation wireless communication, aerospace, and transportation systems is driving the need for high-performance, cost-sensitive silicon RFICs and III-V compound semiconductor monolithic microwave integrated circuits (MMICs), often integrated into advanced system-in-package (SiP) modules.… 

Design and Analysis Solutions for Integrated RF Systems

Opening Keynote 10:00am EST | Cadence Solutions for RF Design Excellence, presented by David Vye, Dr. Melika Roshandell, Graeme Richie, Dr. Yashwanth Reddy Padooru, Gus Dallman, Shane Coffman, Cadence Technical…