Siemens
Calendar of Events
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Siemens EDA User2User Conference
Engineer a smarter future, faster at Siemens EDA User2User Conference April 3-4, 2024 Santa Clara, CA. Join your colleagues from around the industry for a day of technical sessions, networking, keynote sessions, labs and more. User2User is free of charge for Siemens EDA customers and includes sessions, lunch, and parking. Technology tracks covering the latest… Read More »Siemens EDA User2User Conference
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Guiding your aerospace electrical journey
Guiding your aerospace electrical journey
Aerospace electrical/electronic (EE) design requires a delicate balance between innovative technology and uncompromising reliability. Meanwhile, the pressure to get products to market faster is growing exponentially. Finding ways to design electrical systems quickly, cost-effectively and efficiently has become a central focus of manufacturers. Siemens has the solutions and partnerships to guide the development of best-in-class… Read More »Guiding your aerospace electrical journey
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Win The Tick to Trade Race by Root Causing Bugs Faster with the Latest Innovations In QuestaSim
Win The Tick to Trade Race by Root Causing Bugs Faster with the Latest Innovations In QuestaSim
Root causing RTL design or simulation testbench bugs can be tedious process, especially if just relying on traditional waveform viewing and debug. Also, it can be costly if more sophisticated debug ties up precious simulation resources during the debug process. Learn how the latest innovations in QuestaSim address these challenges by enabling full off-line… Read More »Win The Tick to Trade Race by Root Causing Bugs Faster with the Latest Innovations In QuestaSim
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CICC 2024
The IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations, exhibits, panels and forums. The conference sessions present original first published technical work and innovative circuit techniques that tackle practical problems. CICC is the conference to find out how to solve design… Read More »CICC 2024
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42nd VLSI Test Symposium
The IEEE VLSI Test Symposium (VTS) explores emerging trends and novel concepts in test, validation, yield, reliability, and security of microelectronic circuits and systems. The symposium will take place on April 22-24 2024, in Tempe, AZ, USA. The program includes keynotes, scientific paper presentations, short industrial application paper presentations, special sessions, and Innovative Practices sessions.… Read More »42nd VLSI Test Symposium
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osmosis Aerospace and Defense 2024 A Formal Verification Virtual Event
osmosis Aerospace and Defense (A&D) is about sharing the success in using formal techniques to address the demanding verification requirements and challenges of DO-254 compliant and other high-consequence systems. We have put together the following program covering a wide range of formal verification topics. Day 1 - Tuesday, April 23 10:00am Pacific | 1:00pm… Read More »osmosis Aerospace and Defense 2024 A Formal Verification Virtual Event
Siemens User2User Verification Forum 2024 India
Siemens User2User Verification Forum 2024 India
Join us at the Siemens User2User Verification Forum 2024 in India next week! Gain insights on Smart Verification - Using AI in Functional Verification and learn best practices in design and verification flows that can speed up your ASIC and FPGA design & verification cycle. Don't miss the chance to leverage AI and ML based… Read More »Siemens User2User Verification Forum 2024 India
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Deploying Solido Design Environment AI Workflows on AWS
Deploying Solido Design Environment AI Workflows on AWS
Utilizing AWS cloud resources to accelerate variation-aware verification AI-powered Solido Design Environment provides SPICE-accurate variation-aware verification for 3, 4, 5, 6 and higher sigma targets, orders of magnitude faster than traditional brute-force methods. With cloud computing made more accessible than before, many teams are considering running design and verification workloads, including Solido Design Environment, on… Read More »Deploying Solido Design Environment AI Workflows on AWS
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Siemens User2User Verification Forum 2024 India
Siemens User2User Verification Forum 2024 India
Join us at the Siemens User2User Verification Forum 2024 in India next week! Gain insights on Smart Verification - Using AI in Functional Verification and learn best practices in design and verification flows that can speed up your ASIC and FPGA design & verification cycle. Don't miss the chance to leverage AI and ML based… Read More »Siemens User2User Verification Forum 2024 India
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DFT for chiplets & 3D ICs using Tessent Multi-die
DFT for chiplets & 3D ICs using Tessent Multi-die
3D IC (2.5D/3D) designs are on the rise. Design for Test (DFT) for chiplets must be general purpose so they can be tested stand alone and easy to test after assembly into 2.5D or 3D devices. In this webinar you will learn how to use Tessent Multi-die and still adhere to standards like IEEE 1149.1,… Read More »DFT for chiplets & 3D ICs using Tessent Multi-die
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Smart methods for DFT chip architecture & validation
Smart methods for DFT chip architecture & validation
Combining market-leading design-for-test (DFT) technologies with best-in-class netlist synthesis allows you to achieve DFT success more quickly. Many customers, including those for emulation and IC test, have challenges with scaling architectures. This webinar describes how Siemens emulation and silicon test solutions can work together to provide a smart DFT plug-and-play architecture for Veloce ICs. The… Read More »Smart methods for DFT chip architecture & validation