Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive losses are temperature dependent. In this webinar, we will look at an electrothermal co-simulation solution for the full hierarchy of electronic systems… Read More »CadenceTECHTALK: System-Level Thermal Signoff from Chips Through to Racks