CadenceTECHTALK: System-Level Thermal Signoff from Chips Through to Racks

Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive losses are temperature dependent.

In this webinar, we will look at an electrothermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures using Cadence’s Celsius technologies. By combining FEA for solid structures with computational fluid dynamics (CFD) for both liquid and gas, as well as airflow, designers can perform complete system analysis in a single tool. The combined workflow that ties the Celsius Thermal Solver with the Celsius Electronic Cooling Solver results in even higher accuracy and faster simulation time in the modeling of electronics equipment.

Speakers:

• Melika Roshandell, Product Management Director, Cadence Design Systems
• Karthick Gopalakrishnan, Product Director, Cadence Design Systems

For questions and inquiries, or issues with registration, send an email to events@cadence.com.