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CadenceTECHTALK: System-Level Thermal Signoff from Chips Through to Racks
April 27 @ 10:00 am - 11:00 am PDT
Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive losses are temperature dependent.
In this webinar, we will look at an electrothermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures using Cadence’s Celsius technologies. By combining FEA for solid structures with computational fluid dynamics (CFD) for both liquid and gas, as well as airflow, designers can perform complete system analysis in a single tool. The combined workflow that ties the Celsius Thermal Solver with the Celsius Electronic Cooling Solver results in even higher accuracy and faster simulation time in the modeling of electronics equipment.
- Melika Roshandell, Product Management Director, Cadence Design Systems
- Karthick Gopalakrishnan, Product Director, Cadence Design Systems
For questions and inquiries, or issues with registration, send an email to firstname.lastname@example.org.
Product Management Director, Cadence Design Systems
Dr. Melika Roshandell is the product management director for Celsius Thermal Solver software at Cadence. Prior to Cadence, she held positions as a system-on-chip (SoC) thermal engineer at Qualcomm for nine years and thermal engineer at Broadcom for two years. Dr. Roshandell earned her BS in mechanical engineering at the University of California, San Diego, and her MS and Ph.D. in mechanical engineering at the University of California, Irvine.
Product Director, Cadence Design Systems
Karthick Gopalakrishnan is a product engineer for Celsius Thermal Solver at Cadence Design Systems. He holds a Master’s Degree in Mechanical Engineering from North Carolina State University, specializing in thermal and fluid sciences.