Voltus

Power network design and analysis of 3D-ICs is a major challenge because of the complex nature and large size of the power network. In addition, designers must deal with the complexity of routing power through the interposer, multiple dies, through-silicon vias (TSVs), and through-dielectric vias (TDVs). In this webinar, you will learn how the Cadence… Addressing 3D-IC Power Integrity Design Challenges