Addressing 3D-IC Power Integrity Design Challenges

Power network design and analysis of 3D-ICs is a major challenge because of the complex nature and large size of the power network. In addition, designers must deal with the complexity of routing power through the interposer, multiple dies, through-silicon vias (TSVs), and through-dielectric vias (TDVs). In this webinar, you will learn how the Cadence Integrity 3D-IC Platform and Voltus IC Power Integrity Solution provides:

• Fully integrated solution for early planning and analysis of 3D-IC power networks
• 3D-IC chip-centric power integrity signoff
• Hierarchical methods that significantly improve the capacity and performance of power integrity signoff while maintaining a very high level of accuracy at signoff