Skip to content
Synopsys, May 21, 2024

The Next Generation of 3DIC Interposer/InFO Design

In recent years, the semiconductor industry has experienced a breakthrough in the onset of 2.5D and 3D chiplet-based products. These products promise to extend the limits of Moore’s Law while demolishing limitations on speed and… The Next Generation of 3DIC Interposer/InFO Design

Siemens EDA

Protocol and Memory Interface Verification in the Shrinking World of 3DIC

Emerging 2.5D and 3DIC packaging technologies enable more design complexity, and bring some new verification challenges. We look at how to scale your verification capability to match and how to plan ahead for verification of… Protocol and Memory Interface Verification in the Shrinking World of 3DIC