In recent years, the semiconductor industry has experienced a breakthrough in the onset of 2.5D and 3D chiplet-based products. These products promise to extend the limits of Moore’s Law while demolishing limitations on speed and… The Next Generation of 3DIC Interposer/InFO Design
Dear SIPI Engineer, As a member of the engineering community, you are invited to attend Synopsys Signal & Power Integrity Special Interest Group event taking place at Hilton Santa Clara. This event is conveniently located… Signal & Power Integrity Special Interest Group
For some high-performance computing (HPC) designs, monolithic SoCs aren’t producing the scalability and yield that designers are looking for. New trends towards 3DIC design are emerging introducing new design challenges, such as reliable die-to-die connectivity,… 3DIC Design from Concept to Silicon