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Tessent, February 9, 2023

Implementing DFT in 2.5/3D designs using Tessent Multi-die software

In the era of more-than-Moore’s law, chip makers are scaling by adopting complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D). There has… Read More »Implementing DFT in 2.5/3D designs using Tessent Multi-die software

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