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SNUG Silicon Valley 2025

SNUG Silicon Valley 2025

Connecting the Synopsys User Community SNUG conferences have connected Synopsys global users for more than three decades. SNUG 2025 will once again provide a place where users and technical experts can meet, network, and share… 

ICCAD-Expo 2024

ICCAD-Expo 2024

The China Integrated Circuit Design Industry Exhibition (ICCAD-Expo) has always played an important role in promoting industrial agglomeration, connecting industrial resources, and mastering industry trends.

TSMC, November 19, 2024

2024 TSMC Europe OIP Ecosystem Forum

Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric… 

TSMC OIP 2024

TSMC North America OIP Ecosystem Forum 2024

Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric… 

ChipEx 2024

ChipEx 2024

ChipEx2024, the largest annual event of the Israeli semiconductor industry, will be held on May 7-8, 2024 in Tel Aviv, Israel. ChipEx2024 showcases companies including manufacturers, developers and suppliers of advanced hardware technologies & services.… 

SNUG Silicon Valley 2024

SNUG Silicon Valley 2024

Connecting the Synopsys User Community SNUG conferences have connected Synopsys global users for more than three decades. SNUG 2024 will once again provide a place where users and technical experts can meet, network, and share… 

Chiplet Summit 2024

Chiplet Summit

The Second Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power,… 

TSMC 2023

TSMC 2023 North America OIP Ecosystem Forum

Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22 Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®,… 

ChipEx 2022

ChipEx 2022

ChipEx2022 The main event of the Israeli semiconductor industry, will be held on May 10, 2022 at the Expo Tel Aviv Conference Center. The event is expected to attract thousands of industry professionals including engineers, development managers, project…