Advancements in memory technology are fueling rapid growth in big data applications across AI, 5G, Automotive, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated, while the latest… Memory Users Conference 2024 – China, Taiwan
Advancements in memory technology are fueling rapid growth in big data applications across AI, 5G, Automotive, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated, while the latest… Memory Users Conference 2024
Emerging 2.5D and 3DIC packaging technologies enable more design complexity, and bring some new verification challenges. We look at how to scale your verification capability to match and how to plan ahead for verification of… Protocol and Memory Interface Verification in the Shrinking World of 3DIC
With advanced packaging and interface solutions, it is possible to connect multiple CPU clusters (near or far) and share external memory resources among them. We will review some of the IPs required to build such… Scalable HPC platform and memory expansion techniques using Die-to-Die and LPDDR subsystems