As AI is redefining communication and connectivity, your ability to design, simulate, and test — using an intelligent and automated workflow — is what will set you apart. Join us for a half-day event that… Keysight EDA Connect Tour – Burlington
Keysight is excited to announce the next destination stops of our EDA Connect World Tour: Austin, TX and Burlington, MA. Save the dates for our upcoming events in Austin, TX on May 2 or Burlington, MA on May 16,… Keysight EDA Connect Tour – Austin
Connecting the Synopsys User Community SNUG conferences have connected Synopsys global users for more than three decades. SNUG 2024 will once again provide a place where users and technical experts can meet, network, and share… SNUG Silicon Valley 2024
Shift Left with the Modern Design Center Artificial intelligence (AI) is redefining communication and connectivity. Your ability to design, simulate, and test — using an automated, integrated workflow — is what will set you apart.… Keysight EDA Connect World Tour: Santa Clara – RF Day
Artificial intelligence (AI) and virtual reality (VR) require fast, efficient, low-power technologies. Transistors are becoming harder and harder to shrink, so chiplets are a promising alternative. Chiplets are small, modular dies that use UCIe, an open industry standard, to communicate… Why Chiplets with UCIe are the Next Big Thing
The XXII International Workshop on the Physics of Semiconductor Devices (IWPSD 2023) is being jointly organized by the Indian Institute of Technology Madras in collaboration with Society for Semiconductor Devices and Semiconductor Society (India). This… International Workshop on Physics of Semiconductor Devices – IWPSD 2023
We’re inviting global partners and customers to our upcoming Samsung Foundry Forum (SFF) and Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2023. The events will provide opportunities to share insights and innovative technologies to build a… Samsung Foundry Forum 2023 EMEA
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring… EPEPS 2023
Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22 Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®,… TSMC 2023 North America OIP Ecosystem Forum
On behalf of the DVCon India 2023 steering committee, it is my pleasure to welcome you all to the 8th edition of the Design and Verification Conference in India planned from 13- 14th September 2023… DVCon India 2023