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Cadence, June 15, 2022

How Static and Dynamic IR Drop Analysis Can Help PCB Designs Challenges

  • June 14, 2022May 26, 2022

As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package… Read More »How Static and Dynamic IR Drop Analysis Can Help PCB Designs Challenges

Cadence, May 4, 2022

Signal and Power Integrity Analysis with Sigrity Aurora

  • May 4, 2022April 8, 2022

Join Cadence Training and Principal Application Engineer Vladimir Papic for this free technical Training Webinar. Cadence® Sigrity™ Aurora is a signal and power integrity (SI/PI)… Read More »Signal and Power Integrity Analysis with Sigrity Aurora

Siemens EDA, December 8

Ensuring Standards Compliance: Automating Post-Route Analysis for Hundreds of Serial Links

  • December 8, 2021November 29, 2021

Presented by Todd Westerhoff, Product Marketing Manager for High-Speed System Design, Siemens EDA Abstract The PCB layout team has just handed you back a routed… Read More »Ensuring Standards Compliance: Automating Post-Route Analysis for Hundreds of Serial Links

Thermal Analysis

Thermal Analysis for MMIC and RF PCB Power Applications

  • October 5, 2021September 21, 2021

Overview The Cadence® Celsius™ Thermal Solver is now integrated with the Cadence AWR Design Environment® V16 platform, supporting electrothermal analysis for MMIC/RFIC, PCB, and module designs.… Read More »Thermal Analysis for MMIC and RF PCB Power Applications

EMA Design Automation

Common Challenges when Designing IoT PCBs – And How to Solve Them with Cadence

  • September 29, 2021September 23, 2021

While IoT devices may seem simple to the end users (which is good), the electrical design complexity of these devices is often very high. Designers… Read More »Common Challenges when Designing IoT PCBs – And How to Solve Them with Cadence

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