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Cadence, November 15, 2022

Three Issues Every EE Needs to Overcome to Sign Off on High-Speed PCB Designs

Signal integrity/power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density circuit boards. Faster signoff of designs can be achieved by uncovering signal… Read More »Three Issues Every EE Needs to Overcome to Sign Off on High-Speed PCB Designs

Cadence, August 30, 2022

Integrated Thermal Analysis for RF MMIC and PCB Power Applications

Join us for this one-hour CadenceTECHTALK to learn how the Cadence Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated… Read More »Integrated Thermal Analysis for RF MMIC and PCB Power Applications

Ansys, August 9, 2022

2022 R2: What’s New in Ansys Signal & Power Integrity

About this Event The 2022 R2 Ansys Signal and Power Integrity release introduces significant simulation improvements for electronic printed circuit boards, IC packages, and interposers.… Read More »2022 R2: What’s New in Ansys Signal & Power Integrity

Cadence, June 15, 2022

How Static and Dynamic IR Drop Analysis Can Help PCB Designs Challenges

As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package… Read More »How Static and Dynamic IR Drop Analysis Can Help PCB Designs Challenges

Cadence, May 4, 2022

Signal and Power Integrity Analysis with Sigrity Aurora

Join Cadence Training and Principal Application Engineer Vladimir Papic for this free technical Training Webinar. Cadence® Sigrity™ Aurora is a signal and power integrity (SI/PI)… Read More »Signal and Power Integrity Analysis with Sigrity Aurora

Thermal Analysis

Thermal Analysis for MMIC and RF PCB Power Applications

Overview The Cadence® Celsius™ Thermal Solver is now integrated with the Cadence AWR Design Environment® V16 platform, supporting electrothermal analysis for MMIC/RFIC, PCB, and module designs.… Read More »Thermal Analysis for MMIC and RF PCB Power Applications

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