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User2User Europe 2024
May 7, 2024 @ 9:00 am - 10:00 pm CEST
User2User is the perfect opportunity to learn, share and network with fellow technical experts who design leading-edge products using Siemens EDA tools.
Dedicated to end-users of Siemens EDA solutions, this conference is free to attend and includes innovative keynotes from industry leaders, enriching technical sessions as well as a chance to network with colleagues and peers.
The full programme includes papers on these topics
- Design For Test & Embedded Analytics
- Electronic System Design/PCB Design analysis and manufacturing
- Functional Design & Verification
- Hardware Assisted Verification
- High Level Synthesis: Digital design in C++/SystemC
- Custom IC Verification
- IC Backend
- Semiconductor packaging design, analysis and manufacturing
Keynotes
Enabling imagination – An integrated approach to system design – Mike Ellow
Mike Ellow is the Executive Vice President of Electronic Design Automation (EDA) Global Sales Services and Customer Support for Siemens in North America.
Delivering Silicon at Cloud Scale – Ronen Laviv
Ronen Laviv is the Enterprise Account Manager and EDA Sales Consultant at Amazon Web Services (AWS) based in Israel.
Technical breakouts
- IC Backend Track 1
- Improving the accuracy of Design for Manufacturability (DFM) sign-off checks with machine learning
- Signoff with Calibre as platform independent application
- Utilizing Calibre Tools for Chipfinishing within a Markefile
- IC Backend Track 2
- PERC-LDL Auto Waivers flow applied to Voltage Dependent Rules in BCD technologies
- Mission IR Possible – Full Chip IR Drop Analysis of CMOS Cine-Image Sensor with Mpower
- Custom IC Verification
- Symphony Pro enablement in STMicroelectronics SmartPower Technologies
- How AWS cloud compute helps scale custom IC verification workloads
- PLL Design and Simulation using the Advanced SPICE technology
- Accelerating verification of high frequency PLLs for Wireless Application in a Smarter World
- Design for Test & Embedded Analytics
- Advancing DFT with the Power of AI: Grand challenges