Skip to content
TSMC 2022 EU

TSMC 2022 EU OIP Ecosystem Forum

Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E, N4/N4P, N5/N5A, N6/N7, N12e, N22, and 28eF technologies Latest 3DIC chip stacking and advanced packaging processes, and innovative 3DIC design… TSMC 2022 EU OIP Ecosystem Forum

proteantecs, november 16, 2022

The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges. Join us on Wednesday, November 16… The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

proteanTecs, April 12, 2022

The Changing Landscape of Automotive Electronics

The automotive industry is undergoing a seismic shift. Supply chain constraints, software defined architectures, functional safety requirements, and the changing dynamics between OEMs, Tier 1s and semiconductor companies, are driving the industry to seek innovative… The Changing Landscape of Automotive Electronics

proteanTecs, February 9, 2022

Zero Trust Supply Chains and the Risk of Gray Market Chips

The recent shortage of chip supply and long lead times prompted system makers to turn to second tier suppliers and distributors for fulfilling their semiconductor needs. This in turn has put a spotlight on the… Zero Trust Supply Chains and the Risk of Gray Market Chips