Skip to content
proteantecs, november 16, 2022

The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges. Join us on Wednesday, November 16… 

proteanTecs, April 12, 2022

The Changing Landscape of Automotive Electronics

The automotive industry is undergoing a seismic shift. Supply chain constraints, software defined architectures, functional safety requirements, and the changing dynamics between OEMs, Tier 1s and semiconductor companies, are driving the industry to seek innovative…