Cadence Further Streamlines MMIC, RFIC, and RF SiP Design Workflows
Demand for next-generation wireless communication, aerospace, and transportation systems is driving the need for high-performance, cost-sensitive silicon RFICs and III-V compound semiconductor monolithic microwave integrated circuits (MMICs), often integrated… Read More »Cadence Further Streamlines MMIC, RFIC, and RF SiP Design Workflows