Abstract The integrated circuit industry faces new challenges as chip complexity and area have been increasing to prohibitive ranges. Some segments have been adopting then a relatively new paradigm for heterogeneous integration based on chiplets… Signal and Power Integrity Challenges in Advanced Packaging Technologies for Disaggregated Integration
Join our webinar to discover how AI-driven optimization and automation in constraint generation can boost productivity and shorten design cycles for PCB and IC package design. Learn how integrating Allegro X and Sigrity X can… AI-Driven Constraint Generation for PCB and IC Package Design
Signal and power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density PCBs. Easy-to-use in-design analysis directly integrated into the Allegro PCB design environment uncovers SI/PI issues early in the design process, leading… Seamless SI/PI Signoff of Allegro PCB Designs Driven by In-Design Analysis
The heterogeneous integration of chips/chiplets has added significant complexity to the IC package design process, further compressing schedules for many design teams. Design teams must work more efficiently to meet quality and performance goals while… Meet Advanced IC Package Design Schedule Challenges with In-Design Analysis
IC package design teams and characterization teams have had a “throw-it-over-the-wall” relationship for decades, which often delays design releases by months. However, as signal integrity (SI) and power integrity (PI) challenges evolve with multi-die heterogeneous… Design Robust IC Packages Faster Using In-Design SI/PI Analysis
The Peripheral Component Interconnect Express (PCIe®) high-speed interface has become the standard for computer expansion cards due to its high bandwidth combined with manageable component costs. However, the latest PCIe 6.0 release raises new challenges… Conquer SI/PI Challenges and Reduce Time to Signoff for PCIe 6.0