The 6th PIC International conference will build on the success of its predecessors, with industry-leading insiders delivering more than 30 presentations spanning four sectors. Attendees… Read More »PIC International Conference
The IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD) is the premier forum for technical discussions in all areas of power semiconductor devices… Read More »IEEE ISPSD 2022
AMBA is a set of interconnect specifications that standardizes on chip communication mechanisms between various functional blocks (or IP) for building SOC designs. Silvaco’s AMBA… Read More »AMBA AHB Subsystems and How to Customize, Secure, and Verify
Many TFT technologies in the market today are based on 4-terminal devices. In contrast, the SPICE simulators from other vendors can only support 3-terminal TFT… Read More »Learn How to Improve TFT-Based Flat Panel Designs with the Unique SmartSpice 4-Terminal TFT Model
Silicon IGBT and SiC MOSFETs are today’s key power semiconductor switches for many power electronics converters such as those in automotive, renewables and industrial applications.… Read More »Learn How mqSemi AG Developed 3D Power Devices Proof of Concept with Silvaco TCAD Simulations
At high frequency, the accurate modeling of parasitic elements is crucial to IC design. Substrate behavior is a significant contributor to such parasitics, and its… Read More »How Silvaco TCAD is at the Heart of Innovation in RF Devices
In this webinar we will examine some of the key features and advantages of Utmost IV for device modeling and characterization, and the major design… Read More »How to Optimize and Boost Your Device Modeling and Characterization with Utmost IV
Gallium Nitride based devices are highly attractive for both RF and power switching applications due to a combination of outstanding materials properties. However, although the… Read More »How to Use Device Simulation as a Tool for Understanding GaN HEMTS
Physical Verification is the most critical stage of IC design. SmartDRC/LVS is a new physical verification tool for analog, digital and mixed-signal ICs including design… Read More »How to Improve Physical Verification Productivity with SmartDRC/LVS
FinFET technologies have enabled designs with increased density and performance while reducing power, when compared to MOSFET. However, this comes at a cost of increased… Read More »Managing the Complexity of FinFET Standard Cell Layout with Cello