ME-Pro™ is a unified tool for designers, process developers, modeling engineers, and PDK engineer providing robust simulation and analysis capabilities for semiconductor device model verification and evaluation. This comprehensive platform supports evaluation across device, circuit,… Interactive SPICE Model Verification Platform ME-Pro
Join us and learn how Siemens’ intelligent Custom IC Verification platform is transforming the custom IC verification landscape with AI-powered methods and the latest in circuit simulation technology! Our expert speakers will provide insight on… Siemens EDA Custom IC Verification Forum – Austin, TX
Overview Electromagnetic Compatibility (EMC) simulation is critical for ensuring that electronic devices comply with regulatory standards and perform optimally in their intended environments. As the complexity of electronic systems increases, the importance of EMC simulation… Mastering EMC Simulations for Electronic Designs
Utilizing AWS cloud resources to accelerate variation-aware verification AI-powered Solido Design Environment provides SPICE-accurate variation-aware verification for 3, 4, 5, 6 and higher sigma targets, orders of magnitude faster than traditional brute-force methods. With cloud… Deploying Solido Design Environment AI Workflows on AWS
The demand for Custom ICs is on the rise globally along with high proliferation of semiconductor content. Higher requirements on power, performance, area, and yield, as well as other factors such as advanced process nodes… SPICE-accurate variation-aware verification best practices with Solido AI-powered technologies
We start by examining the different technologies used in the manufacturing of power devices, including Si, GaN, and SiC, considering their respective particularities and advantages. We will then analyze various approaches to the SPICE modeling… Power Devices SPICE Modeling for Si, GaN and SiC Technologies
Image retention is a long-standing issue in the display community. To effectively solve this issue, or even to minimize its impact on their products, display manufacturers and consumer electronics vendors need to simulate this effect… How to Eliminate Image Retention Issues with SmartSpice Flex Modeling
In this webinar we will examine some of the key features and advantages of Utmost IV for device modeling and characterization, and the major design flows where Utmost IV is a key component. We will… How to Optimize and Boost Your Device Modeling and Characterization with Utmost IV
There have always been good reasons to port designs to new foundries or processes. These reasons have included reusing IP in new projects, moving an entire design to a smaller node to improve PPA, or… Optimal circuit sizing strategies for performance, low power, and high yield of analog and full custom IP
I’ll never forget the shock when I ran some SPICE simulations as a new college graduate working at Intel and my 5V part had a circuit that doubled the VCC supply towards 10V internally to… Interoperability and EDA Bugs