EDPS 2024 is now taking shape. The place to be is once again SEMI, in Milpitas, and the dates are Thursday and Friday, Oct 3rd and 4th, 2024. Registration is now open: https://2024-ieee-edps.eventbrite.com. Who needs to… Electronic Design Process Symposium (EDPS) – 2024
The International Conference on Computer-Aided Design focuses on advancements and research in the field of electronic design automation (EDA) and computer-aided design (CAD) for integrated circuits and systems. Topics include innovations in design methodologies, tools,… ICCAD 2024
Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric… TSMC North America OIP Ecosystem Forum 2024
Register for the Synopsys VC Formal Special Interest Group (SIG) event today. This event provides an opportunity for users, managers, and enthusiasts to stay connected with the latest formal verification innovations, techniques and methodologies. Industry… VC Formal Special Interest Group
Cocotb 2.0 is the latest major version of cocotb, ironing out many quirks that have accumulated over the years. With only small changes to your testbenches, you can benefit from improved typing and less surprising… Cocotb 2.0: Modernize your testbenches for even more productivity
The EOS/ESD Symposium is dedicated to the understanding of issues related to electrostatic discharge and electrical transients/overstress, and the application of this knowledge to the solution of problems in consumer, industrial, and automotive applications, including… 46th Annual EOS/ESD Symposium & Exhibits
A worldwide connected Event !! D&R IP-SoC South Korea 2024 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. IP-SoC providers, the seed of innovation… IP-SoC South Korea 24
Join us at this year’s Synopsys Signoff SIG (Special Interest Group) event. Signoff is a critical quality control checkpoint in the chip development process, but design complexity and advance process nodes are pushing the boundaries… Signoff Special Interest Group
Memory fabrics unlock the power to pool, tier, and share memory in a data center fabric. The results will be vastly more memory capacity and lower cost due to higher utilization—the things needed to support… Q3 Memory Fabric Forum
Advancements in memory technology are fueling rapid growth in big data applications across AI, 5G, Automotive, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated, while the latest… Memory Users Conference 2024 – China, Taiwan