Skip to content
Cadence April 27, 2023

CadenceTECHTALK: System-Level Thermal Signoff from Chips Through to Racks

Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive losses are… CadenceTECHTALK: System-Level Thermal Signoff from Chips Through to Racks