Optimizing connectivity between Xpedition and HFSS for RF systems design

In today’s fast-paced technological landscape, seamless integration between design and simulation tools is crucial for accelerating product development cycles and ensuring optimal performance of electronics, especially RF systems. Siemens Xpedition and Ansys HFSS stand as pillars in their respective domains, offering powerful capabilities for electronic design and electromagnetic simulation.

In this live conversation, Sara Louie from Ansys and Per Viklund from Siemens will describe the two-way connectivity between Siemens Xpedition and Ansys HFSS, revolutionizing the electronic design and simulation workflow. We delve into the details of bidirectional data exchange, enabling engineers to seamlessly transfer layout geometries and parameters between the two platforms.