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TSMC 2023 Open Innovation Platform Ecosystem Forum – China
November 15, 2023 @ 8:00 am - 5:00 pm UTC+8
Join us at the TSMC 2023 China OIP Ecosystem Forum!
China OIP Ecosystem Forum (In-Person Event)
Date: November 15, 2023 (Wednesday)
Time: 9:30a.m. – 5:45p.m.
Venue: Shangri-La Nanjing Hotel
329 Zhongyang Road, Gulou District, Nanjing, Jiangsu Province, 210037 China
China OIP Ecosystem Forum (Online VOD Event)
Date: November 22, 2023 (Wednesday)
Website link to be provided in November.
Learn About:
- Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22
- Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications
- Comprehensive design solutions for specialty technologies enabling ultra-low power, ultra-low voltage, analog migration, RF, mmWave, and automotive designs targeting 5G, automotive, and IoT designs
- Ecosystem specific TSMC reference flow implementations, P&R optimization, machine learn-ing to improve design quality and productivity, and cloud-based design solutions
- Successful , real-life applications of design technologies and IP solutions from TSMC’s Open Innovation Platform Ecosystem members and TSMC customers to speed up time-to-design and time-to-market
For more information on the TSMC OIP Ecosystem Forum, e-mail us at: events@pl-marketing.biz.
We look forward to seeing you at the 2023 TSMC OIP Ecosystem Forum!