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Implementing DFT in 2.5/3D designs using Tessent Multi-die software
In the era of more-than-Moore’s law, chip makers are scaling by adopting complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D). There has been progress throughout the semiconductor… Read More »Implementing DFT in 2.5/3D designs using Tessent Multi-die software
Webinar: The Rise of the Chiplet
Join us this Thursday, February 9th to talk about The Rise of the Chiplet. Moderated by SemiEngineering’s Brian Bailey, this webinar will dive into the current landscape for chiplet technology, predictions… Read More »Webinar: The Rise of the Chiplet