ISTFA 2023
Phoenix Convention Center 100 North Third Street, PhoenixSaving global resources by increasing energy efficiency is among the most significant problems that global society must address today. To achieve this, a major target is developing efficient and reliable… ISTFA 2023
PCB Design Best Practices: Design Automation
re you harnessing the full power of your PCB design software? In this live discussion, experts Stephen Chavez and Ray Macias will discuss the benefits of using PCB design automation, and… PCB Design Best Practices: Design Automation
DVCon Europe 2023
Holiday Inn Munich - City Centre Hochstraße 3, MunichThe Design and Verification Conference & Exhibition Europe (DVCon Europe) is the premier European technical conference on system, software, design, verification, validation and integration. It is a place where the… DVCon Europe 2023
Automated Constraints Promotion Methodology from IP to SoC for Complex Designs
IP cores require integration into top-level subsystems and/or SoCs. Writing constraints manually for top level design is prone to errors and difficult to verify and manage. This Synopsys webinar will… Automated Constraints Promotion Methodology from IP to SoC for Complex Designs
Leverage Certified RISC-V IP to Craft ASIL ISO 26262 Grade Automotive Chips
As semiconductor industry leaders, Bosch, Infineon, Nordic Semiconductor, NXP, and Qualcomm collaborate to drive the acceleration of automotive RISC-V semiconductors, join us for an insightful webinar on how you too… Leverage Certified RISC-V IP to Craft ASIL ISO 26262 Grade Automotive Chips
Why Chiplets with UCIe are the Next Big Thing
Artificial intelligence (AI) and virtual reality (VR) require fast, efficient, low-power technologies. Transistors are becoming harder and harder to shrink, so chiplets are a promising alternative. Chiplets are small, modular dies that use UCIe, an… Why Chiplets with UCIe are the Next Big Thing