Latest Past Events

Multi-Die System Verification with Siemens Avery UCIe VIP

Conventional monolithic SoCs are becoming a bottleneck for power, performance, and area (PPA), creating limitations for Data-intensive applications like high-performance computing (HPC), machine learning (ML) and artificial intelligence (AI), and… 

Rigid Flex PCB In-Design Electromagnetic Analysis Workflow

Today's electronic products increasingly use Rigid-Flex PCBs to compress form factors, reduce weight, and increase cost-effectiveness. For many commercially available 3D numerical solver technologies (FEM and FDTD), the electromagnetic (EM) analysis… 

Latest Innovations and Updates in ASICs with Efabless

In this webinar Jeff DiCorpo & Matt Venn will delve into the latest ASIC developments, including the game-changing OpenFrame – a new Caravel version expanding your design possibilities by 50%.…