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Multi-Die System Verification with Siemens Avery UCIe VIP
Conventional monolithic SoCs are becoming a bottleneck for power, performance, and area (PPA), creating limitations for Data-intensive applications like high-performance computing (HPC), machine learning (ML) and artificial intelligence (AI), and…
Rigid Flex PCB In-Design Electromagnetic Analysis Workflow
Today's electronic products increasingly use Rigid-Flex PCBs to compress form factors, reduce weight, and increase cost-effectiveness. For many commercially available 3D numerical solver technologies (FEM and FDTD), the electromagnetic (EM) analysis…
Latest Innovations and Updates in ASICs with Efabless
In this webinar Jeff DiCorpo & Matt Venn will delve into the latest ASIC developments, including the game-changing OpenFrame – a new Caravel version expanding your design possibilities by 50%.…