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Enhance Verification Quality with the Xcelium Mixed-Signal App
The comprehensive verification of analog mixed-signal (AMS) designs has challenges in schedules and implementations due to the vast divergence in design flows of the analog and digital portions of the SoC. These discrepancies include priorities in simulation cycles (accuracy versus performance), design methodologies, and verification of functionality. Over multiple decades, design verification (DV) has evolved… Enhance Verification Quality with the Xcelium Mixed-Signal App
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Mastering the Art of Managing IP, Chiplets, and Design Data
Join us on Wednesday, November 1st, for an eye-opening exploration of the inadequacy of common design data and IP management capabilities in the face of today’s intricate semiconductor chip designs. Discover the keys to unlocking unparalleled success in your upcoming designs through cutting-edge capabilities and strategies that are reshaping the industry. Don’t miss this exclusive opportunity… Mastering the Art of Managing IP, Chiplets, and Design Data
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Warp Speed Gate-Level Simulations with the Xcelium Multi-Core App
Are you ready to lead the way in gate-level digital simulations (GLS)? Dive into Cadence’s exclusive webinar and uncover the revolutionary Xcelium Multi-Core (MC) App—a game changer for GLS, allowing you to parallelize and expedite simulations like never before. What You'll Gain: Insight: Understand why the Xcelium MC App is crucial for DV engineers looking… Warp Speed Gate-Level Simulations with the Xcelium Multi-Core App
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RISC-V in Space
Omni Interlocken Hotel 5000 Interlocken boulevard, Broomfield, CO, United StatesJoin us for "RISC-V in... Space" on November 2, 2023, as we explore the exciting intersection of RISC-V, electronics design, and space! Agenda 9:30 AM - 10:00 AM Registration & Welcome 10:00 AM - 12:00 PM Case Study Presentations: Tenstorrent, Synopsys, RISC AI, Arteris IP 12:00 PM - 1:00 PM Lunch Buffet 1:00 PM - 3:00 PM Case Study Presentations: Breker Systems, Imperas,… RISC-V in Space
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IR 2.0 – Building a New Paradigm for Power Integrity Design and Analysis
Cadence Design Systems, Building 5 2655 Seely Avenue, San Jose, CA, United StatesPower integrity (PI) is a major challenge for chip designers in the era of ubiquitous data, hyperconnectivity, and AI. Design size is exploding, and innovations in heterogenous integration are adding to PI complexity. These changes and challenges are ushering in the IR2.0 era ― a new paradigm for power integrity design and analysis. As a… IR 2.0 – Building a New Paradigm for Power Integrity Design and Analysis
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RISC-V Summit US
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesEach day, thousands of engineers around the world collaborate and contribute to advance RISC-V, the open-standard instruction set architecture that is defining the future of open computing. The RISC-V community shares the technical investment and helps shape the architecture’s strategic future so everyone may create more rapidly, enjoy unprecedented design freedom, and substantially reduce the… RISC-V Summit US
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RISC-V 101
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesThe RISC-V Instruction Set Architecture (ISA) is the future of computing. As an open standard, RISC-V is accelerating innovation and enabling unprecedented design freedom across every computing application. You've seen the headlines and stories. Now, here's your chance to learn all about RISC-V and why it is being rapidly adopted by organizations of all size… RISC-V 101
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IESA AI Summit
Trident Hotel Hyderabad Hyderabad, IndiaExperience the unprecedented growth opportunities in the semiconductor and electronics industry, fueled by rapid advancements in Artificial Intelligence (AI). Embrace the paradigm shift from software-centric approaches to hardware-centric solutions, captivating emerging markets in the realm of AI. Witness the powerful convergence of breakthrough technologies like the Internet of Things (IoT) and AI, igniting a renaissance… IESA AI Summit
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Proactive Data Center Management with Insight Platform
The DataCenter Insight Platform is an enterprise software solution that simplifies data center capacity management by making it proactive, rather than reactive. The platform is a database of data center “digital twins”—virtual models reflecting the aggregate of an organization’s toolsets and add/move/change workflows. By bringing together data that is typically siloed and using predictive computational… Proactive Data Center Management with Insight Platform
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TSMC 2023 Taiwan OIP Ecosystem Forum
Ambassador Hotel Hsinchu 0F, No.188, Sec. 2, Zhonghua Rd., Hsinchu City, TaiwanLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22 Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile… TSMC 2023 Taiwan OIP Ecosystem Forum
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Deep Dive into the UVM Register Layer: User-Defined Doors, Predictors, and Callbacks
This webinar focuses on three specific aspects of the UVM register layer that will help you to model in UVM some of the less obvious ways in which registers can behave, such as non-linear addressing, burst access mode, registers accessed through an embedded CPU, and quirky registers. It will cover the following topics: Using user-defined… Deep Dive into the UVM Register Layer: User-Defined Doors, Predictors, and Callbacks
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CMOS Circuit Techniques for Wireline Transmitters Part I
Synopsys Webinar – Part I In this 3-part Synopsys webinar series, we will present how hyperscale data centers are going through a paradigm shift with the advent of technologies like Artificial Intelligence (AI) and edge compute requiring hyperscale data centers to support exponential growth of data volume. This volume of network traffic demands an increase… CMOS Circuit Techniques for Wireline Transmitters Part I
12 events found.