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TSMC 2024 China Technology Symposium
Shanghai International Convention Center No. 2727, Riverside Avenue, Shanghai, ChinaGet the latest on: TSMC's industry-leading HPC, smartphone, IoT, and automotive platform solutions TSMC’s advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond TSMC’s specialty technology breakthroughs on… TSMC 2024 China Technology Symposium
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FV-Israel, Summit 2024
Connect with industry experts, academics, and enthusiasts for discussions on FV in Israel. Explore new developments from top semiconductor firms, advanced EDA tools, and academic research. Engage with leaders, exchange… FV-Israel, Summit 2024
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Reimagining Synopsys SLM PVT Monitoring IP for Advanced Node GAA Process
Synopsys' SLM PVT Monitor (process detector, voltage monitor, temperature sensor) IP can collect voltage, temperature, and process parameters from different blocks within the IC in real time. These data can… Reimagining Synopsys SLM PVT Monitoring IP for Advanced Node GAA Process
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Optimizing connectivity between Xpedition and HFSS for RF systems design
In today's fast-paced technological landscape, seamless integration between design and simulation tools is crucial for accelerating product development cycles and ensuring optimal performance of electronics, especially RF systems. Siemens Xpedition… Optimizing connectivity between Xpedition and HFSS for RF systems design
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Addressing Real-Time Workloads in Automotive Applications with Efficient ARC-V Processors
Many automotive applications require processing workloads with minimum latency and precise timing budgets. This is especially true for safety-critical applications like adaptive cruise control and anti-lock braking, where human life… Addressing Real-Time Workloads in Automotive Applications with Efficient ARC-V Processors
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Advantest VOICE 2024
Hilton La Jolla Torrey Pines 10950 N Torrey Pines Rd, La Jolla, CA, United StatesVOICE is a developer conference, created by test engineers for test engineers. Each year, the VOICE Developer Conference unites semiconductor test professionals representing the world's leading integrated device manufacturers (IDMs),… Advantest VOICE 2024
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PCB East 2024
Boxboro Regency Hotel and Conference Center 242 Adams Pl, Boxborough, MA, United StatesThe Electronics Industry’s East Coast Conference and Exhibition. 1. Educational opportunities. No matter how experienced you are, everyone can learn! PCB East is widely acknowledged as the best technical conference… PCB East 2024
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Verification Academy Live: Westford (Boston Area)
Westford Regency Inn and Conference Center 219 Littleton Rd, Westford, MA, United StatesWestford Regency Inn and Conference Center 219 Littleton Rd Westford, MA 01886 +1 (978) 692-8200 This event is in-person only -- there is no support for remote participation. Agenda 9:30… Verification Academy Live: Westford (Boston Area)
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Silicon.da: The First Integrated SLM Analytics Solution from Design Through Manufacturing
Today’s advanced node chip designs are faced with many new complexities which require more verification, more validation and more analysis. The resulting data from these added steps has also grown… Silicon.da: The First Integrated SLM Analytics Solution from Design Through Manufacturing
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Verification Academy Live: Huntsville
Siemens Training Center 360E Quality Circle, Suite 500, Huntsville, AL, United StatesSiemens Training Center 360E Quality Circle, Suite 500 Huntsville, AL 35806 +1 (256) 705-2501 This event is in-person only -- there is no support for remote participation. Agenda 9:30 –… Verification Academy Live: Huntsville
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International Workshop on Logic and Synthesis – IWLS 2024
ETH Zurich Rämistrasse 101, Zurich, SwitzerlandThe International Workshop on Logic and Synthesis is the premier forum for research in synthesis, optimization, and verification of integrated circuits and systems. Research on logic synthesis for emerging technologies… International Workshop on Logic and Synthesis – IWLS 2024
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Addressing Thermal Stress and Warpage Challenges in 3D-IC Designs
Thermal stress analysis plays a crucial role in the design and performance optimization of packaging materials and boards, especially in industries where temperature variations are significant. This webinar presents a… Addressing Thermal Stress and Warpage Challenges in 3D-IC Designs
12 events found.