Addressing Thermal Stress and Warpage Challenges in 3D-IC Designs

Thermal stress analysis plays a crucial role in the design and performance optimization of packaging materials and boards, especially in industries where temperature variations are significant. This webinar presents a comprehensive overview of recent developments in the newly-introduced Cadence Celsius Studio AI-enabled multiphysics thermal platform to solve today’s thermal stress and warpage analysis in 3D-ICs.

Celsius Studio offers support for linear and nonlinear material structural models as well as static and quasi-static solvers for warpage and stress analysis and a moisture solver and high-temperature, high-humidity (HTHH) analysis. Designers can perform multi-stage simulations for the design assembly process and material failure and reliability analysis. There are global and local models for 3D-IC warpage/stress simulation.

You will learn about:

• Recent developments in Celsius Studio that address thermal stress and warpage analysis in 3D-ICs, including die-to-die sacking, packing, and boards warpage
• Key methods that can be used to address factors affecting thermal stress, including nonlinear material properties, geometric configuration, and environmental conditions
• Example models for 3D-IC warpage/stress simulation