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Introduction to UCIe
UCIe™ — Universal Chiplet Interconnect Express™ — is an open industry standard founded by the leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers to address customer requests for more customizable package-level integration. The newly formed UCIe Consortium fosters an open chiplet ecosystem by offering high-bandwidth, low-latency, power-efficient, and cost-effective on-package connectivity between… Introduction to UCIe
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AI-Powered Prediction for Semiconductor Designs
Join our live Webinar on AI-Powered Prediction for Semiconductor Designs. Hear from experts at TOffeeAM, Machine Discovery, and Nvidia on the latest advancements in AI-powered thermal management, analog verification, and building the AI factory. A must-attend for professionals in the semiconductor, electronics, and AI industries. Register now! Speakers Marco Pietropaoli TOffeeAM Marco is the CEO… AI-Powered Prediction for Semiconductor Designs
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RISC-V Webinar from Andes
Andes Technology is going to host a webinar at 17:00 PM on February 22 (Japan Standard Time (JST) and Korea Standard Time (KST)). Andes speakers will present Andes comprehensive hardware and software solutions. Samuel Chiang, Deputy Technical Director of Marketing, will present a wide range of applications which have adopted RISC-V solutions and will introduce… RISC-V Webinar from Andes
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Learn How TCAD is a Key Enabler for Photodiode Development
Photodiodes are a key technology to many growing application areas. Automotive vision systems, advanced industrial machinery, and high-speed communications systems all rely on photodiodes to link optical inputs into usable electrical signals. In this webinar, Silvaco will discuss these technologies, and how TCAD can be broadly applied to multiple detector topology and material sets, thereby… Learn How TCAD is a Key Enabler for Photodiode Development
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Phil Kaufman Award & Banquet
The GlassHouse 2 S Market Street, San Jose, CA, United StatesThe Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. Time 6:30… Phil Kaufman Award & Banquet
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Hardware Security 2.0: What Are The New Frontiers?
The CAD for Trust and Assurance website is an academic dissemination effort by researchers in the field of hardware security. The goal is to assemble information on all CAD for trust/assurance activities in academia and industry in one place and share them with the broader community of researchers and practitioners in a timely manner, with… Hardware Security 2.0: What Are The New Frontiers?
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DVCon U.S. 2023
DoubleTree Hotel 2050 Gateway Place, San Jose, CA, United StatesThe 2023 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative, announces its call for extended abstract proposals. The submission site for extended abstracts will be open from July 11 through August 8, 2022. DVCon U.S. 2023 will be held February 27-March 2, 2023, at the Doubletree Hotel in San Jose, California.… DVCon U.S. 2023
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Mobile World Conference, MWC 2023
Fira Gran Via 08038, Barcelona, SpainMWC Barcelona is the largest and most influential event for the connectivity ecosystem. Whether you’re a global mobile operator, device manufacturer, technology provider, vendor, content owner, or are simply interested in the future of tech, you need to be here. Why? Because it’s the one time of year where everyone who’s anyone comes together under… Mobile World Conference, MWC 2023
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Linting and Clock Domain Crossing Analysis for Microchip FPGA Designs
The use of advanced verification tools can significantly reduce the number of non-trivial bugs, save engineering time and resources and, more importantly, increase the reliability of FPGA designs. Static design verification is an essential part of a robust verification process that includes advanced linting and Clock Domain Crossing (CDC) analysis. In this webinar, we will… Linting and Clock Domain Crossing Analysis for Microchip FPGA Designs
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THE DATA REVOLUTION OF SEMICONDUCTOR PRODUCTION
The demand for efficient and scalable chip production has never been greater. The need to scale at volume and adapt to shorter innovation cycles makes machine learning and advanced data analytics essential components of semiconductor production. Join us on Tuesday, March 7, 2023, for this 1-hour panel discussion with industry experts from Qualcomm, Microsoft Azure and Advantest as we discuss… THE DATA REVOLUTION OF SEMICONDUCTOR PRODUCTION
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MumbaiFOSS
IIT Bombay Powaj, Maharashtra, Bombay, IndiaMumbaiFOSS is a conference which aims to bring software developers, communities, policy makers and enthusiasts together, so we can learn and inspire each other. This event is happening in collaboration with FOSSEE, IIT Bombay. Agenda for MumbaiFOSS FOSS Product Showcase Deep Dive of Issues and Trends in Open Source Interact with the larger FOSS Community… MumbaiFOSS
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19th Annual Device Packaging Conference (DPC 2023)
WeKoPa Conference Center 10438 WeKoPa Way, Fort McDowell, AZ, United StatesThe most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers and top experts participating in a multi-faceted technical program and unique networking events. Full… 19th Annual Device Packaging Conference (DPC 2023)
12 events found.