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Tessolve AI Strategy & Eco System for DV
With the increasing importance of AI in engineering and the exciting potential for it’s use in Design Verification, Tessolve has been working on improving internal DV processes, with impressive reductions in both effort and costs, and with many clients to improve both efficiency and quality in DV through AI. In this series of 3 short… Tessolve AI Strategy & Eco System for DV
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AI-Driven Constraint Generation for PCB and IC Package Design
Join our webinar to discover how AI-driven optimization and automation in constraint generation can boost productivity and shorten design cycles for PCB and IC package design. Learn how integrating Allegro X and Sigrity X can streamline your workflow. Key Takeaways: Learn how the Sigrity Topology Workbench, a robust system-level SI/PI environment for what-if and pre-route… AI-Driven Constraint Generation for PCB and IC Package Design
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Optimize Systems and Semiconductor Architecture for Deep Learning Algorithms Using System-Level Modeling
In a world where artificial intelligence and machine learning are embedded in critical applications—from real-time tracking and object detection to autonomous systems—the architecture behind these innovations must be both powerful and efficient. To help engineers and architects address these challenges, our upcoming webinar will demonstrate how System-Level Modeling can be a game-changer in optimizing the performance and… Optimize Systems and Semiconductor Architecture for Deep Learning Algorithms Using System-Level Modeling
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Workshop on Open Source EDA Technologies (WOSET)
Virtual! No registration fee! The WOSET workshop aims to galvanize the open-source EDA movement. The workshop will bring together EDA researchers who are committed to open-source principles to share their experiences and coordinate efforts towards developing a reliable, fully open-source EDA flow. The workshop will feature presentations and posters that overview existing or under-development open-source… Workshop on Open Source EDA Technologies (WOSET)
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2024 TSMC Europe OIP Ecosystem Forum
Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701 Amsterdam, Amsterdam, NetherlandsLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design… 2024 TSMC Europe OIP Ecosystem Forum
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Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design
The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has been quickly evolving with early experiences leading to the development of more advanced implementation and analysis techniques. For the past years, Synopsys and Ansys have… Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design
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Fast Track RTL Debug with the Verisium Debug Python App Store
Working with debugging scripts locally and manually can be challenging, as can reusing and organizing them. What if there was a way to create your own app with the required functionality and to register it with the tool? The answer lies in the Verisium Debug Python App Store. Instantly add additional features and capabilities to… Fast Track RTL Debug with the Verisium Debug Python App Store
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Ansys IDEAS User Conference India 2024
Join us for the Ansys IDEAS India User Conference 2024 — a place to catch up on industry best practices and the latest Semiconductor design advances. IDEAS will explore future trends with keynotes from industry leaders and offer technical insights from expert chip designers from many of the world’s top semiconductor companies. Overview At this… Ansys IDEAS User Conference India 2024
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Tower Semiconductor – Technical Global Symposium 2024
Hyatt Regency Santa Clara 5101 Great America Parkway, Santa Clara, CA, United StatesTGS offers a wonderful opportunity for networking, learning, and sharing the latest technology developments with our community, as well as meeting with Tower’s executives and team of experts. We invite you to join us! Time Session Speaker 9:00 – 10:00 Registration 10:00 – 10:05 Opening Mr. Lei Qin, SVP of Worldwide Sales 10:05 – 10:40… Tower Semiconductor – Technical Global Symposium 2024
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Webinar 2: Tessolve AI assisted DV Flow
With the increasing importance of AI in engineering and the exciting potential for it’s use in Design Verification, Tessolve has been working on improving internal DV processes, with impressive reductions in both effort and costs, and with many clients to improve both efficiency and quality in DV through AI. In this series of 3 short… Webinar 2: Tessolve AI assisted DV Flow
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Boost your verification productivity with Questa Verification IQ
This session will explore Questa Verification IQ (VIQ), Siemens EDA’s next-generation collaborative and data-driven verification solution. VIQ revolutionizes the verification process by providing advanced analytics, enhanced collaboration, and comprehensive traceability. By leveraging machine learning, VIQ significantly enhances verification efficiency to boost your productivity. What you will learn: How to implement a collaborative, plan-driven verification process,… Boost your verification productivity with Questa Verification IQ
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Accelerating Electric Vehicle Development: Integrated design flow for power modules with functional safety and reliability focus
This webinar to delve into the integrated design flow for power modules for electric vehicles (EVs) for enhanced functional safety and reliability. The power modules are distinguished by their high voltage and current requirements, substantial power dissipation, and the resulting temperature rise. Ensuring their safety and reliability is paramount. We will explore how Cadence’s cutting-edge… Accelerating Electric Vehicle Development: Integrated design flow for power modules with functional safety and reliability focus
12 events found.