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Phil Kaufman Award & Banquet
The GlassHouse 2 S Market Street, San Jose, CA, United StatesThe Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. Time 6:30… Phil Kaufman Award & Banquet
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Hardware Security 2.0: What Are The New Frontiers?
The CAD for Trust and Assurance website is an academic dissemination effort by researchers in the field of hardware security. The goal is to assemble information on all CAD for trust/assurance activities in academia and industry in one place and share them with the broader community of researchers and practitioners in a timely manner, with… Hardware Security 2.0: What Are The New Frontiers?
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DVCon U.S. 2023
DoubleTree Hotel 2050 Gateway Place, San Jose, CA, United StatesThe 2023 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative, announces its call for extended abstract proposals. The submission site for extended abstracts will be open from July 11 through August 8, 2022. DVCon U.S. 2023 will be held February 27-March 2, 2023, at the Doubletree Hotel in San Jose, California.… DVCon U.S. 2023
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Mobile World Conference, MWC 2023
Fira Gran Via 08038, Barcelona, SpainMWC Barcelona is the largest and most influential event for the connectivity ecosystem. Whether you’re a global mobile operator, device manufacturer, technology provider, vendor, content owner, or are simply interested in the future of tech, you need to be here. Why? Because it’s the one time of year where everyone who’s anyone comes together under… Mobile World Conference, MWC 2023
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Linting and Clock Domain Crossing Analysis for Microchip FPGA Designs
The use of advanced verification tools can significantly reduce the number of non-trivial bugs, save engineering time and resources and, more importantly, increase the reliability of FPGA designs. Static design verification is an essential part of a robust verification process that includes advanced linting and Clock Domain Crossing (CDC) analysis. In this webinar, we will… Linting and Clock Domain Crossing Analysis for Microchip FPGA Designs
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THE DATA REVOLUTION OF SEMICONDUCTOR PRODUCTION
The demand for efficient and scalable chip production has never been greater. The need to scale at volume and adapt to shorter innovation cycles makes machine learning and advanced data analytics essential components of semiconductor production. Join us on Tuesday, March 7, 2023, for this 1-hour panel discussion with industry experts from Qualcomm, Microsoft Azure and Advantest as we discuss… THE DATA REVOLUTION OF SEMICONDUCTOR PRODUCTION
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MumbaiFOSS
IIT Bombay Powaj, Maharashtra, Bombay, IndiaMumbaiFOSS is a conference which aims to bring software developers, communities, policy makers and enthusiasts together, so we can learn and inspire each other. This event is happening in collaboration with FOSSEE, IIT Bombay. Agenda for MumbaiFOSS FOSS Product Showcase Deep Dive of Issues and Trends in Open Source Interact with the larger FOSS Community… MumbaiFOSS
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19th Annual Device Packaging Conference (DPC 2023)
WeKoPa Conference Center 10438 WeKoPa Way, Fort McDowell, AZ, United StatesThe most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers and top experts participating in a multi-faceted technical program and unique networking events. Full… 19th Annual Device Packaging Conference (DPC 2023)
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19th International Conference & Exhibition on Device Packaging
We-Ko-Pa Resort & Conference Center 10438 Wekopa Way, Fort McDowell, AZ, United StatesThe most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers and top experts participating in a multi-faceted technical program and unique networking events. Full… 19th International Conference & Exhibition on Device Packaging
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SEMI-THERM
DoubleTree Hotel 2050 Gateway Place, San Jose, CA, United StatesSEMI-THERM is an international symposium dedicated to the thermal management and characterization of electronic components and systems. SEMI-THERM provides knowledge covering all thermal scales from integrated circuits to facilities, fosters discussions between thermal engineers, professionals, and industry experts, and encourages the exchange of information on academic and industrial advances in electronics cooling. Symposium Highlights Technical… SEMI-THERM
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Embedded World
NürnbergMesse Messezentrum 1, Nurnberg, GermanyThe embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community, including leading experts, key players and industry associations. It offers unprecedented insight into the world of embedded systems, from components and modules to operating systems, hardware and software design, M2M communication, services, and various issues related to… Embedded World
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March Austin RISC-V Meetup
This will be an on-line event. We'll be the RISC-V Bivy virtual meeting system. The use of a microphone and/or camera are not required to participate in the event, chat will be monitored. We'll be discussing current and future hardware releases, state of various software projects, and plans for future meetups. We're also going to… March Austin RISC-V Meetup
12 events found.