3D IC
The Era of Software-Defined Everything: Chiplets and Bespoke Silicon
From fintech to automotive, defense to healthcare, everyone wants bespoke computing platforms to build "software-defined solutions" that are differentiated in their respective markets. Sign up and save your spot for this special presentation. Overview With the advent of 3D ICs and heterogeneous semiconductor integration, mapping a system on a customized chip/hardware is accessible to "everyone.”… Read More »The Era of Software-Defined Everything: Chiplets and Bespoke Silicon
DFT for chiplets & 3D ICs using Tessent Multi-die
3D IC (2.5D/3D) designs are on the rise. Design for Test (DFT) for chiplets must be general purpose so they can be tested stand alone and easy to test after assembly into 2.5D or 3D devices. In this webinar you will learn how to use Tessent Multi-die and still adhere to standards like IEEE 1149.1,… Read More »DFT for chiplets & 3D ICs using Tessent Multi-die