3D IC
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Signal and Power Integrity Challenges in Advanced Packaging Technologies for Disaggregated Integration
Abstract The integrated circuit industry faces new challenges as chip complexity and area have been increasing to prohibitive ranges. Some segments have been adopting then a relatively new paradigm for heterogeneous integration based on chiplets at the first package level in combination with advanced 2.5 and 3D packaging technologies. The chiplet approach has the advantage… Signal and Power Integrity Challenges in Advanced Packaging Technologies for Disaggregated Integration
Accelerating SoC Automotive Design with Chiplets
Step into the forefront of innovation with our upcoming webinar, which explores how chiplet technology is revolutionizing the automotive industry and setting new benchmarks. Discover how Cadence is empowering customers to achieve unparalleled success with chiplets. Here's what you can look forward to: Mastering Chiplet Architecture: Dive into the intricacies of mastering chiplet architecture, where… Accelerating SoC Automotive Design with Chiplets
CadenceTECHTALK: Driving Intelligent System Design with 3D-IC Multiphysics
As the industry reaches the limits of device scaling at advanced nodes, there is a growing demand for increased computing performance and data transfer in hyperscale data centers and AI designs. Advanced systems-on-chip (SoCs) are approaching the maximum size limits, and there is a need to find innovative solutions to continue scaling according to Moore's… CadenceTECHTALK: Driving Intelligent System Design with 3D-IC Multiphysics