3D Packaging
Protocol and Memory Interface Verification in the Shrinking World of 3DIC
Emerging 2.5D and 3DIC packaging technologies enable more design complexity, and bring some new verification challenges. We look at how to scale your verification capability to match and how to plan ahead for verification of die-to-die interconnect protocols such as UCIe and memory verification with HBM. Packaging technologies for 2.5D and 3DIC are becoming more… Read More »Protocol and Memory Interface Verification in the Shrinking World of 3DIC
Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis
Join us for this webinar on RF GaN amplifier design using electromagnetic/thermal 3D solvers. We will discuss the step-by-step process of building a GaN amplifier, beginning with the transistor model in the circuit simulator. The webinar will outline the steps required to convert this to a physical layout for electromagnetic simulation and verification while integrating… Read More »Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis