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The Next Generation of 3DIC Interposer/InFO Design
In recent years, the semiconductor industry has experienced a breakthrough in the onset of 2.5D and 3D chiplet-based products. These products promise to extend the limits of Moore’s Law while… The Next Generation of 3DIC Interposer/InFO Design
Signal & Power Integrity Special Interest Group
Hilton Santa Clara 4949 Great America Parkway, Santa ClaraDear SIPI Engineer, As a member of the engineering community, you are invited to attend Synopsys Signal & Power Integrity Special Interest Group event taking place at Hilton Santa Clara.… Signal & Power Integrity Special Interest Group
3DIC Design from Concept to Silicon
For some high-performance computing (HPC) designs, monolithic SoCs aren’t producing the scalability and yield that designers are looking for. New trends towards 3DIC design are emerging introducing new design challenges,… 3DIC Design from Concept to Silicon