2 events found.
AI/ML
Events
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How to Overcome the Pain Points of AI/ML Hardware Design
Join Achronix for a live Webinar December 16th: 10-11 AM Pacific and Recorded On-Demand After the Event AI/ML hardware faces three common pain points: memory bandwidth, computational throughput and on-chip data movement. Next-generation FPGA technology includes a 2D network on chip, GDDR6 memory interfaces and high performance machine learning processors, which present new capabilities to…
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Memory Bandwidth Races Higher with HBM3
With the formal release of the HBM3 specification, memory bandwidth for AI/ML and HPC shifts to a higher gear. Terabytes of bandwidth are possible using HBM3’s 2.5D/3D architecture. Join memory expert Frank Ferro as he discusses what changes come with the new generation of HBM, and how the Rambus HBM3 memory subsystem can help designers…