Allegro
Intelligent Cross-Platform Workflows for RF PCB Integration
The last webinar in The Cadence® AWR® V16 for RF Design Excellence Webinar Seriesintroduces groundbreaking cross-platform workflows from AWR® software to Allegro® PCB Designer, which help to deliver up to a 50% reduction in turnaround time compared to competing solutions. RF IP integration within a larger mixed-signal PCB system is hampered by disjointed workflows between… Read More »Intelligent Cross-Platform Workflows for RF PCB Integration
Connect Your System Architecture Design and Implementation
Join Cadence Training and Senior Application Engineer Dave Palumbo for this free technical Training Webinar. The disconnect between system architecture design and implementation makes creating a system that meets cost, performance, and form factor requirements challenging. Hardware designers need tools that help them engineer systems to meet the goals of their end products within the… Read More »Connect Your System Architecture Design and Implementation
Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows
System designers face increasing challenges in meeting technical specifications and time-to-market requirements. While process nodes continue to shrink, the complexity of packages continues to grow. Large pin counts of flipped and rotated ICs may accidentally lead to I/O misalignment between die and package. Consequently, disjointed design tools and flows create a serious risk of product… Read More »Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows
Seamless SI/PI Signoff of Allegro PCB Designs Driven by In-Design Analysis
Signal and power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density PCBs. Easy-to-use in-design analysis directly integrated into the Allegro PCB design environment uncovers SI/PI issues early in the design process, leading to faster signoff of designs. With analysis shifting left in the design cycle, design teams can achieve efficient signoff of… Read More »Seamless SI/PI Signoff of Allegro PCB Designs Driven by In-Design Analysis